• Render high-resolution textures up to 60% faster

• Get up to 90% less CPU utilization for multitasking with Microsoft DirectStorage6 and GPU decompression

• Load essential assets in seconds

• Aluminum and nickel-plated copper heatsink

• Custom design for higher in-game performance

• 3D render while minimizing throttle9

• Non-heatsink option available1

• Innovator of 232-layer TLC NAND3

• 45-year reputation for industry innovation and leadership

• Top quality, reliability, testing and OEM qualification

• High-speed compatibility with PCIe 5.0 motherboards

• Designed for Intel 13th Gen & AMD Ryzen 7000 series CPUs

• Backward compatible with PCIe 3.0 and 4.0 systems